On August 18, "Huicheng Shares," an investee company of Kunqiao Capital—a sub-fund backed by the mother fund managed by Yuanhe Chencun—officially listed on the STAR Market of the Shanghai Stock Exchange, with stock code: 688403.

Since its establishment in 2015, Huicheng Shares has been dedicated to the high-end and advanced packaging & testing sector, currently focusing specifically on the packaging and testing of display driver chips. The company’s core business revolves around gold bump manufacturing, seamlessly integrating processes such as CP, COG, and COF packaging to deliver comprehensive, end-to-end packaging and testing services for display driver chips. Huicheng Shares’ packaging and testing services cater primarily to display driver chips used in mainstream panels like LCD and AMOLED. The chips it packages and tests are ultimately incorporated into a wide range of consumer electronics, including everyday devices such as smartphones, smart wearables, high-definition TVs, laptops, and tablets.

HuiCheng Shares is one of the earliest advanced packaging and testing enterprises in China to possess gold bump manufacturing capabilities and to introduce a 12-inch wafer gold bump production line, achieving mass production of display driver chips. Relying on stable product yields, advanced packaging and testing technologies, and high-quality service capabilities, it has gained widespread recognition from well-known customers in the industry and accumulated a wealth of high-quality client resources. As a high-tech enterprise, HuiCheng Shares has always adhered to technological innovation as its core driving force, committed to the research and application of advanced packaging technologies. It has mastered multiple core technologies such as micro-pitch driver chip bump manufacturing, accumulated numerous non-patented core technologies and independent intellectual property rights, forming its own competitive advantage in the field of display driver chip packaging and testing.

This time, HuiCheng Shares successfully listed on the ChiNext Board, raising a total of 130 million yuan, which will be primarily allocated to expanding capacity for its 12-inch display driver chip packaging and testing project, building an advanced R&D center, and replenishing working capital. These investments will help HuiCheng Shares further strengthen its production and R&D capabilities in the cutting-edge packaging and testing sector.