On September 19, "Debang Technology," a portfolio company invested in by Sanxing Capital—the sub-fund backed by the mother fund managed by Yuanhe Chukun—officially listed on the STAR Market of the Shanghai Stock Exchange, with stock code: 688035.

Debang Technology (officially known as Yantai Debang Technology Co., Ltd.) was established on January 23, 2003. It is a nationally recognized "Little Giant" enterprise—specialized, refined, distinctive, and innovative—dedicated to the R&D and industrialization of high-end electronic packaging materials. The company’s products include electronic-grade adhesives and functional film materials, widely used in emerging industries such as integrated circuit packaging, smart terminal packaging, and new energy applications. Depending on the specific application area and scenario, the company’s main product categories encompass four key segments: integrated circuit packaging materials, smart terminal packaging materials, new energy application materials, and high-end equipment application materials.

In the field of integrated circuit packaging materials, Debang Technology’s chip die-attach conductive adhesives and other chip mounting materials are being supplied in bulk to several renowned packaging and testing companies, including Tongfu Microelectronics, Huatian Technology, and ChangElectra. Additionally, Debang Technology’s wafer-level UV films are also being delivered in significant quantities to these same major packaging and testing manufacturers. In the area of power battery packaging materials, Debang Technology primarily supplies leading battery manufacturers such as CATL and BYD, holding a prominent market share. Meanwhile, in the photovoltaic stacked-wafer packaging materials segment, Debang Technology’s proprietary core technology-driven PV stacked-crystal materials have already been widely adopted by industry leaders like Tongwei Co., Ltd. and Canadian Solar, giving their products a strong competitive edge and solidifying their position among top market players.

Currently, Debon Technology's smart terminal packaging material products have entered the supply chains of renowned brands such as Apple, Huawei, and Xiaomi Technology, enabling large-scale deliveries. The company is now competing directly with international suppliers across the board and has gradually captured a significant market share in several key smart terminal products, including TWS headphones.

This time, Debang Technology’s fundraising from its IPO will primarily be directed toward a high-end electronic specialty materials production project, a new semiconductor electronic packaging materials construction project with an annual capacity of 35 tons, and the establishment of a state-of-the-art R&D center. All of these investment projects are focused on driving innovation in science and technology.