8 On the 25th of the month, "Tailing Microelectronics," an investee company of Qingyu Fund—a sub-fund backed by the mother fund managed by Yuanhe Chencun—was listed on the STAR Market of the Shanghai Stock Exchange, with stock code: 688591.

TaiLing Microelectronics (Shanghai) Co., Ltd. was established in June 2010 and is a specialized integrated circuit design company. It primarily focuses on the research, development, design, and sales of system-level chips for wireless IoT applications, with a strong emphasis on pioneering technological advancements and breakthroughs in the wireless IoT chip sector. Through years of continuous innovation and R&D efforts, the company has become one of the world's leading enterprises in this niche market, boasting the most comprehensive product portfolio in its category.

Since its establishment, the company has been driven by the vision of "becoming a global leader in IoT chip design," guided by its mission: "Bringing Telink’s chips to users worldwide and helping pave the way toward a fully interconnected world." Under this inspiring mission and vision, the company has successfully developed a series of cutting-edge, system-level wireless IoT chips that boast independent intellectual property rights and deliver world-class performance. These innovative solutions have earned widespread recognition from both customers and the market. Key performance metrics of the company’s flagship products either match or surpass those of leading international competitors, enabling seamless support for a diverse range of consumer and commercial IoT applications—including smart retail, consumer electronics, smart lighting, smart home systems, healthcare tech, warehousing and logistics, and audio-entertainment solutions. The company’s products are already trusted and integrated into devices manufactured by renowned brands such as HanShuo, Xiaomi, Logitech, Home Control, Tuya Smart, Ledvance, Renesas, iFlytek, Konka, Sharp, Panasonic, Nvidia, and Harman, among others.

This IPO will see the company raising funds to support several key initiatives: the IoT product technology upgrade project, the wireless audio product technology enhancement project, as well as projects focused on developing and refining WiFi and multi-mode products. Additionally, the funds will be allocated toward building an advanced R&D center and bolstering the company’s strategic reserves in science and technology. Looking ahead, Telink Micro will remain firmly committed to capitalizing on growth opportunities in the IoT chip sector, continuously launching cutting-edge, market-competitive chip solutions. By doing so, the company aims to strengthen its industry-leading position in low-power, wireless IoT system-on-chip design—and ultimately establish itself as a world-class chip design enterprise with a strong presence in China and a global outlook.